A multifunctional porous interface bridging 3D architected electronics with skin
- Zhangming Shen
- Xu Cheng
- Xiaobin Luo
- Zhenjia Tang
- Xiaonan Hu
- Hongyun Zhang
- Yue Xiao
- Qing Liu
- Shiwei Xu
- Zhi Liu
- Renheng Bo
- Shenglian Yao
- Fan Zhang
- Yihui Zhang
2026-07-08
Skin-integrated flexible electronics are rapidly advancing from short-term use to continuous, long-term wear to meet the demands of health monitoring, wound healing, and skin disease treatment. While three-dimensionally (3D) architected devices offer sensing capabilities and outstanding mechanical performances, the development of a conformal interface between these 3D electronic devices and skin for long-term comfortable wear remains challenging due to their geometric complexity and mechanical fragility. Here, we introduce a multifunctional porous interface that bridges 3D flexible electronics with skin through engineered microporous networks. Such a porous design enhances elastic stretchability and electrical reliability while providing moisture permeability, thermal buffering, impact mitigation, and drug delivery capability. Stiffness reduction and localized pore-wall-shell buckling synergistically underpin the outstanding mechanical resilience under large deformations. The proposed multifunctional porous interface allows development of a 3D closed-loop wound administration patch capable of multimodal sensing and on-demand therapy, markedly accelerating scald wound healing in vivo.