Nature Communications

Improving thermal shock resistance of segmented thermoelectric devices via metal foam integration

• Kuai Yu
• Jiayue Du
• Haoyang Tong
• Yuxin Sun
• Xiaoyue Yang
• Hao Wu
• Xiao Zhang
• Zihang Liu
• Chun Li
• Fengkai Guo
• Jiehe Sui

2026-07-20

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DOI https://doi.org/10.1038/s41467-026-75761-8