Thermoforming 2D films into 3D electronics for high-performance, customizable tactile sensing
- Jungrak Choi
- Chankyu Han
- Donho Lee
- Hyunjin Kim
- Gihun Lee
- Ji-Hwan Ha
- Yongrok Jeong
- Junseong Ahn
- Hyunkyu Park
- Hyeonseok Han
- Seokjoo Cho
- Jimin Gu
- Inkyu Park
2025-05-14
The demand for tactile sensors in robotics, virtual reality, and health care highlights the need for high performance and customizability. Despite advances in vision-based technologies, tactile sensing remains crucial for precise interaction and subtle pressure detection. In this work, we present a design and fabrication method of customizable tactile sensors based on thermoformed three-dimensional electronics. This approach enables ultrawide modulus tunability (10 pascals to 1 megapascal) and superior mechanical properties, including negligible hysteresis and high creep resistance. These features allow the sensor to detect a broad spectrum of pressures, from acoustic waves to body weight, with high performance. The proposed sensors have high sensitivity (up to 5884 per kilopascal), high linearity ( R 2 = 0.999), low hysteresis (<0.5%), and fast response (0.1 milliseconds). We demonstrate applications in human-computer interaction and health care, showcasing their potential in various fields. This platform provides a scalable solution for fabricating versatile, high-performance tactile sensors.