Nature CommunicationsThree-dimensional printing of multilayer stretchable electronics with inclined interconnect accessesWenbo ZhaoYifan DengYu ZhangHongbo TuKanghuan HuangFan BuSufeng ZhouJie PuQinghe CaoCao Guan2026-06-02Full textDOI https://doi.org/10.1038/s41467-026-73989-y