Turing-patterned Ta2S3 enables sub-2 nm diffusion barrier for advanced Cu interconnects
- Xu Tian
- Songjie Yang
- Xiaoyu Liu
- Yupu Tang
- Shanshan Ju
- Renbo Lei
- Jinxiong Li
- Yuancan Ding
- Shengcheng Zhou
- Juntong Kang
- Yuyang Qiao
- Yi Zhou
- Runsheng Wang
- Ming Li
- Gaoda Chai
- Xinwei Wang
2026-04-08